Product Description:

Professional advanced OEM RMA-223 BGA soldering paste flux.
Good immersion and high intensity joint.
Easy to peel off with hands or tweezers, leave no residue.
Won’t oxidation gold, copper, phosphorus, bronze, oxidation.
Prevent contamination during assembly.
223: high viscosity no-clean flux, reprocessing PCB, BGA, PGA , for soldering computer/phone chips.
223 is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
High soaking ，high strength joints.
No-toxic, no-corrosive, strong ability of insulation.
Good insulation and smooth welding surface.
No deterioration no dry.
No poison no corrosion, no damage to parts.

Product Specifications:

Flux Type: 223
Weight: 100gm
Dimension: 93 x 33 x 23mm
Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
Color: Yellow
Insulated: Yes
With Needle Tip: Yes
Application: for soldering and Reballing of computer and phone chips.
Advantage: Good immersion and high intensity joint.
Function: for PCB , BGA , PGA reworking.
100%: New Type, high quality.

MAECENAS IACULIS

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ADIPISCING CONVALLIS BULUM

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