AMAOE Stencil SU-2 (0.12mm) for Power IC (0.12mm)

AMAOE Stencil SU-2 (0.12mm) Description:

Overview

The AMAOE Stencil SU-2 (0.12mm) is a premium-quality stainless steel reballing stencil designed specifically for Power ICs, PMICs, and other BGA (Ball Grid Array) components. This professional-grade stencil is an essential tool for technicians, mobile repair professionals, and electronics engineers who need precise and efficient reballing of power management chips and microcontrollers.

Whether you’re repairing a smartphone motherboard, laptop, gaming console, or industrial circuit board, the AMAOE SU-2 Stencil ensures accurate solder ball placement, improving soldering efficiency and reliability.

Key Features & Benefits

1️⃣ High-Quality Stainless Steel Material

Crafted from durable stainless steel, the AMAOE SU-2 stencil offers superior heat resistance and longevity. Unlike low-quality stencils, it does not warp or degrade under repeated exposure to high temperatures, ensuring long-term usability.

2️⃣ Precision Laser-Cut Openings

The stencil features high-accuracy laser-cut holes that provide perfect alignment for solder paste application. This ensures a smooth and even solder ball formation, reducing the chances of short circuits and cold solder joints.

3️⃣ Optimal Thickness – 0.12mm

With a 0.12mm thickness, this stencil is specifically designed for Power IC reballing, ensuring the ideal balance between stability and flexibility. It allows for precise solder ball formation without excessive paste leakage, which is crucial for delicate PCB repairs.

4️⃣ Wide Compatibility

The AMAOE SU-2 stencil is compatible with various Power ICs, PMICs, and other micro BGA chips, making it a versatile tool for repairing multiple types of electronic devices, including:
✔ Smartphones & Tablets (Apple, Samsung, Xiaomi, etc.)
✔ Laptops & Motherboards
✔ Gaming Consoles (PlayStation, Xbox, Nintendo)
✔ Industrial Circuit Boards
✔ IoT Devices & Embedded Systems

5️⃣ Ideal for Professional Repair & Rework

This stencil is commonly used in service centers, mobile repair labs, and electronics manufacturing facilities. It helps technicians perform reballing with high precision, improving the success rate of Power IC replacements and BGA rework.

6️⃣ Compatible with Hot Air Rework Stations & Infrared Heating

The AMAOE SU-2 stencil works perfectly with hot air rework stations, infrared (IR) reflow machines, and traditional soldering tools. It can handle high-temperature soldering processes without deformation, ensuring reliable performance.

How to Use the AMAOE Stencil SU-2 for Power IC Reballing?

🔹 Step-by-Step Guide:

1️⃣ Prepare the IC:

• Clean the Power IC and PCB surface using isopropyl alcohol (IPA) to remove any dust, oxidation, or residual solder.

2️⃣ Align the Stencil:

• Place the AMAOE SU-2 stencil over the IC pads and ensure proper alignment.
• Use magnification tools if needed for precise positioning.

3️⃣ Apply Solder Paste:

• Spread a thin and even layer of solder paste over the stencil using a squeegee or scraper.
• Make sure each hole receives enough paste to form uniform solder balls.

4️⃣ Remove Excess Paste:

• Gently wipe away any excess solder paste from the stencil’s surface.

5️⃣ Reflow the Solder Balls:

• Use a hot air rework station or infrared heating system to heat the solder paste until it melts and forms perfectly round solder balls.

6️⃣ Remove the Stencil:

• Carefully lift the stencil and check the alignment of the solder balls on the Power IC.

7️⃣ Inspect and Reattach the IC:

• Use a microscope or magnifying glass to inspect the solder balls.
• Reattach the reballed Power IC onto the PCB using a BGA rework station.