AMAOE Stencil QU-3 for Power IC (0.12mm)

The AMAOE Stencil QU-3 Description:

The AMAOE Stencil QU-3 (0.12mm) is a high-precision reballing tool designed for Qualcomm CPU and Power IC repairs. Crafted from durable stainless steel, this stencil ensures accurate alignment and efficient soldering during BGA rework processes. It is compatible with various Qualcomm CPU models, including MSM7225A, MSM8909, MSM8928, MSM8940, MSM8952, MSM8612, and SDM660, making it suitable for repairing devices from brands like Xiaomi, Huawei, Oppo, and Vivo.

Key Features:

• Precision Engineering: The 0.12mm thickness allows for meticulous solder paste application, ensuring reliable connections during reballing.

• Durable Material: Made from high-quality stainless steel, the stencil offers longevity and resistance to deformation under high temperatures.

• Wide Compatibility: Supports a range of Qualcomm CPU models, enhancing its versatility for various mobile device repairs.

• User-Friendly Design: The stencil’s design facilitates easy handling, making it suitable for both professional technicians and DIY enthusiasts.

Incorporating the AMAOE QU-3 Stencil into your repair toolkit can significantly improve the efficiency and accuracy of your BGA reballing tasks, ensuring high-quality repairs for a variety of mobile devices.