AMAOE Stencil MQ-1 for Power IC (0.12mm)

AMAOE Stencil MQ-1 (0.12mm) Description:

The AMAOE Stencil MQ-1 (0.12mm) is a high-precision reballing tool designed for Qualcomm and MediaTek (MTK) CPU and Power IC repairs. Crafted from durable stainless steel with a thickness of 0.12mm, it ensures accurate alignment and efficient solder paste application during BGA rework processes. This stencil is compatible with various CPU models, including:

• Qualcomm:

  • SDM710
  • SDM845 A/B
  • SDM660

• MediaTek (MTK):

  • MT6771V
  • MT6739V
  • MT6757V
  • MT6763V

These compatibilities make it suitable for repairing devices from various manufacturers.

Key Features:

• Precision Engineering: The 0.12mm thickness allows for meticulous solder paste application, ensuring reliable connections during reballing.

• Durable Material: Made from high-quality stainless steel, the stencil offers longevity and resistance to deformation under high temperatures.

• Wide Compatibility: Supports a range of Qualcomm and MTK CPU models, enhancing its versatility for various mobile device repairs.

• User-Friendly Design: The stencil’s design facilitates easy handling, making it suitable for both professional technicians and DIY enthusiasts.

Incorporating the AMAOE MQ-1 Stencil into your repair toolkit can significantly improve the efficiency and accuracy of your BGA reballing tasks, ensuring high-quality repairs for a variety of mobile devices.

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